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SS6526
Dual USB High-Side Power Switch
FEATURES
* 110m (5V Input) High-Side MOSFET Switch. 500mA Continuous Load Current per Channel. 110A Typical On-State Supply Current. 1A Typical Off-State Supply Current. Current-Limit / Short Circuit Protection. Thermal Shutdown Protection under Overcurrent Condition. Undervoltage Lockout Ensures that Switch is off at Start Up. Output can be Forced Higher than Input
DESCRIPTION
The SS6526 is a dual high-side power switch for self-powered and bus-powered Universal Serial Bus (USB) applications. Both high-side switches are MOSFET with 110m RDS(ON), which meets USB voltage drop requirements for maximum transmission wire length. Multi-purpose indicates open-drain fault flag output thermal
over-current
limiting,
shutdown, or undervoltage lockout for each channel. Output current is typically limited to 1A, and the thermal shutdown functions of the power switches independently control their channel under overcurrent condition. Guaranteed minimum output rise time limits inrush current during hot plug-in as well as minimizing EMI and prevents the voltage at upstream port from dropping excessively.
(Off-State). Open-Drain Fault Flag. Slow Turn ON and Fast Turn OFF. Enable Active-High or Active-Low.
APPLICATIONS
USB Power Management. Hot Plug-In Power Supplies. Battery-Charger Circuit.
Pb-free; RoHS-compliant
10/23/2007 Rev.1.00
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SS6526
TYPICAL APPLICATION CIRCUIT
VCC 5.0V 4.50V to 5.25V Upstream VBUS 100mA max VBUS D+ DGND + 1F CIN + 33F 10K SS6722 IN OUT USB Controller VIN ON/OFF AIC1526 CTLA FLGA FLGB OUTA IN GND 0.1F VBUS + 33F D+ 0.01F DGND Ferrite Bead 10K
+
GND
OVERCURRENT OVERCURRENT ON/ GND
10F COUT
*
CTLB OUTB
DATA
DATA
*
33F, 16V Tantalum, or 100F, 10V Electrolytic Bold line indicate high- current traces
+
33F
*
0.01F
VBUS D+ DGND DATA
Two-Port Self-Powered Hub
ORDERING INFORMATION
SS6526 - XXXXX PACKING TYPE TR: TAPE & REEL TB: TUBE PACKAGING TYPE N: DIP-8 S: SOP-8 O: MSOP-8 C: Commercial G: Lead Free Commercial CONTROL POLARITY 0: Active Low 1: Active High Example: SS6526-0CSTR Active Low Version, in SOP-8 Package & Taping & Reel Packing Type (CN is not available in TR packing) SS6526-1PSTR Active High Version, in Lead Free SOP-8 Package & Taping & Reel Packing Type PIN CONFIGURATION
DIP-8 SOP-8 TOP VIEW CTLA 1 FLGA 2 FLGB 3 CTLB 4 MSOP-8 TOP VIEW CTLA 1 FLGA 2 FLGB 3 CTLB 4 8 OUTA 7 IN 6 OUTB 5 GND 8 OUTA 7 IN 6 GND 5 OUTB
10/23/2007 Rev.1.00
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SS6526
ABSOLUTE MAXIMUM RATINGS
Supply Voltage (VIN) Fault Flag Voltage (VFLG) Fault Flag Current (IFLG) Control Input (VCTL) Operating Temperature Range Junction Temperature Storage Temperature Range Lead Temperature (Soldering, 10sec) Thermal Resistance,
JA
7.0V 7.0V 50mA -0.3V ~7V -40C~85C 125C -65C ~ 150C 260C 100C/W 160C/W 180C/W SOP-8 MSOP-8
(Junction to Ambient) DIP-8
(Assume no Ambient Airflow, no Heatsink) Thermal Resistance, (Junction to Case)
JC
DIP-8............................................60C /W SOP-8..........................................40C /W MSOP-8........................................75C /W
Absolute Maximum Ratings are those values beyond which the life of a device may be impaired.
TEST CIRCUIT
10K R1 10K R2 ON 10 VCC +5V
CTLA
OFF
OUTA IN
R4
FLGA
0.1F C1
FLGB
ON
GND
10
CTLB
OFF
OUTB SS6526
R4
10/23/2007 Rev.1.00
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SS6526
ELECTRICAL CHARACTERISTICS
(VIN= 5V, TA=25C, unless otherwise specified.) (Note 1)
PARAMETERS Supply Current Control Input Voltage Control Input Current Control Input Capacitance Output MOSFET Resistance Output Turn-On Rise Delay Output Turn-On Rise Time Output Turn-Off Delay Output Turn-Off Fall Time Output Leakage Current Current Limit Threshold Over Temperature Shutdown Threshold Error Flag Output Resistance Error Flag Off Current UVLO Threshold TJ Increasing TJ Decreasing VIN = 5V, IL =10 mA VIN = 3.3V, IL =10mA VFLG = 5V VIN Increasing VIN Decreasing 0.6 1.0 135 125 10 15 0.01 2.6 2.4 25 40 1 A V RL = 10 each Output RL = 10 each Output RL = 10 each Output RL = 10 each Output CONDITIONS VCTL =Logic "0", OUT=Open VCTL =Logic "1", OUT=Open VCTL =Logic "0" VCTL =Logic "1" VCTL =Logic "0" VCTL =Logic "1" 2.4 0.01 0.01 1 110 100 1000 0.8 0.7 2500 20 20 10 1.25 150 1 1 MIN. TYP. 0.75 110 MAX. 5 160 0.8 UNIT A V A pF m S S S S A A C
Note 1: Specifications are production tested at TA=25C. Specifications over the -40C to 85C operating temperature range are assured by design, characterization and correlation with Statistical Quality Controls (SQC).
10/23/2007 Rev.1.00
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SS6526
TYPICAL PERFORMANCE CHARACTERISTICS
118 116 150 140
ON Resistance (m )
114 112 110 108 106 104 3.0 3.5 4.0 4.5 5.0 5.5
RL=47 TA=25C
ON Resistance (m )
130 120 110 100 90 80
RL=47 TA=25C
-40
-20
0
20
40
60
80
100
Supply Voltage (V) Fig. 1 ON Resistance vs. Supply Voltage
3.0
160
Temperature (C) Fig. 2 Output On Resistance vs. Temperature
Threshold Voltage (V)
2.8
140
Rising
2.6
Supply Current (A)
120
2.4
Falling
100
2.2
Both Switches ON
80
2.0 -40
-20
0
20
40
60
80
100
60 3 4 5 6 7 8
Temperature (C) Fig. 3 UVLO Threshold Voltage vs. Temperature
130
Supply Voltage (V) Fig. 4 ON-State Supply Current vs. Supply Voltage
0.10
Supply Current (A)
Supply Current (A)
120
0.08
110
0.06
Both Switches ON
100
Both Switches OFF
0.04
90
0.02
80 -40
-20
0
20
40
60
80
100
0
-40
-20
0
20
40
60
80
100
Temperature (C) Fig. 5 ON State Current vs. Temperature
Temperature (C) Fig. 6 OFF-State Current vs. Temperature
10/23/2007 Rev.1.00
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SS6526
TYPICAL PERFORMANCE CHARACTERISTICS
0.10 1.7 1.6 0.08
(Continued)
Supply Current (A)
0.06
Enable voltage
1.5 1.4 1.3
VEN Rising
Both Switches OFF
0.04
VEN Falling
1.2 1.1
0.02
0 3 4 5 6 7 8
1.0
3.0
3.5
4.0
4.5
5.0
5.5
Supply Voltage (V) Fig. 7 OFF-State Current vs. Supply Voltage
Supply Voltage (V) Fig. 8 Control Threshold vs. Supply Voltage
6
Control (V)
4
FLG VOUT
2
0
5
1A
RL=47
Output (V)
3
1 -1 0.0 0.5 1.0
IOUT
2.0 2.5
1.5
Time (mS) Fig. 9 Turn-On, Turn-Off Characteristics
Fig. 10 Current Limit Response
10/23/2007 Rev.1.00
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SS6526
BLOCK DIAGRAM
OUTA
FLGA Driver CTLA Charge Pump Thermal Shutdown Current Limit CS Power N-MOSFET
UVLO
IN Power N-MOSFET OUTB
Charge Pump CTLB FLGB
Current Limit
CS
Driver
PIN DESCRIPTIONS
PIN 1: CTLA - Controls the turn-on/turn-off of channel A MOSFET with TTL as a control input. Active high for SS6526-1 and active low for SS6526-0. PIN 2: FLGA - An active-low and open-drained fault flag output for channel A. FLGA is an indicator for current limit when CTLA is active. In normal mode operation (CTLA or/and CLTB is active), it also can indicate thermal shutdown or undervoltage. PIN 3: FLGB - An active-low and open-drained fault flag output for channel B. FLGB is an indicator for current limit when CTLB is active. In normal mode operation (CTLB or/and CLTA is active), it also can indicate thermal shutdown or undervoltage. PIN 4: CTLB - Controls the turn-on/turn-off of channel B MOSFET with TTL as a control input. Active High for SS6526-1 and active low for SS6526-0. PIN 5: OUTB - Channel B MOSFET switch output. PIN 6: GND PIN 7: IN - Chip power ground. - Power supply input.
PIN 8: OUTA - Channel A MOSFET switch output.
10/23/2007 Rev.1.00
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SS6526
APPLICATION INFORMATION
Error Flag
An error Flag is an open-drained output of an N-channel MOSFET. FLG output is pulled low to signal the following fault conditions: input undervoltage, output current limit, and thermal shutdown.
Supply Filtering
A 0.1F to 1F bypass capacitor from IN to GND, located near the device, is strongly recommended to control supply transients. Without a bypass capacitor, an output short may cause sufficient ringing on the input (from supply lead inductance) to damage internal control circuitry.
Current Limit
The current limit threshold is preset internally. It protects the output MOSFET switches from damage resulting from undesirable short circuit conditions or excess inrush current, which is often encountered during hot plug-in. The low limit of the current limit threshold of the SS6526 allows a minimum current of 0.6A through the MOSFET switches. The error flag signals when any current limit conditions occur.
Transient Requirements
USB supports dynamic attachment (hot plug-in) of peripherals. A current surge is caused by the input capacitance of downstream device. Ferrite beads are recommended in series with all power and ground connector pins. Ferrite beads reduce EMI and limit the inrush current during hot-attachment by filtering high-frequency signals.
Thermal Shutdown
When temperature of SS6526 exceeds 135C for any reasons, the thermal shutdown function turns both MOSFET switches off and signals the error flag. A hysteresis of 10C prevents the MOSFETs from turning back on until the chip temperature drops below 125C. However, if thermal shutdown is triggered by chip temperature rise resulting from overcurrent fault condition of either one of the MOSFET switches, the thermal shutdown function will only turn off the switch that is in overcurrent condition and the other switch can still remain its normal operation. In other words, the thermal shutdown function of the two switches is independent of each other in the case of overcurrent fault.
Short Circuit Transient
Bulk capacitance provides the short-term transient current needed during a hot-attachment event. A 33F/16V tantalum or a 100F/10V electrolytic capacitor mounted close to downstream connector each port should provide transient drop protection.
Printed Circuit Layout
The power circuitry of USB printed circuit boards requires a customized layout to maximize thermal dissipation and to minimize voltage drop and EMI.
10/23/2007 Rev.1.00
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8
SS6526
APPLICATION CIRCUIT
USB Controller
AIC1526
Vbus
1
2
CTLA
FLGA FLGB
CTLB
OUTA IN
8 7
Vbus
USB Host
3
4.7uF
GND OUTB
6 5
0.1uF
33uF
Downstream USB Device
4
GND Cable
GND
Bus Powered Hub
Cable
Fig. 11 Soft Start (Single Channel)
SS6526 Vbus 1 2 USB Host 3 4.7uF 4 CTLA FLGA FLGB CTLB OUTA IN GND OUTB 33uF GND Cable
USB Peripheral
USB Controller 8 7 6 0.1uF 5 33uF USB Device USB Device
Fig. 12 Inrush Current-Limit Application
10/23/2007 Rev.1.00
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9
SS6526
PHYSICAL DIMENSIONS (unit: mm)
SOP-8
D
S Y M B O L
SOP-8 MILLIMETERS MIN. 1.35 0.10 0.33 0.19 4.80 3.80 1.27 BSC 5.80 0.25 0.40 0 6.20 0.50 1.27 8 MAX. 1.75 0.25 0.51 0.25 5.00 4.00
H
E
A A1 B C
h X 45
D
SEE VIEW B
A
A
e
E e H
A
h L
B
A1
C
WITH PLATING
BASE METAL
0.25
GAUGE PLANE SEATING PLANE
L
VIEW B
Note: 1.Refer to JEDEC MS-012AA. 2.Dimension "D" does not include mold flash, protrusions or gate burrs. Mold flash, protrusion or gate burrs shall not exceed 6 mil per side. 3.Dimension "E" does not include inter-lead flash or protrusions. Inter-lead flash or protrusion shall not exceed 10 mil per side. 4.Controlling dimension is millimeter, converted inch dimensions are not necessarily exact.
10/23/2007 Rev.1.00
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SS6526
DIP-8
D
E
GAUGE PLANE
S Y M B O L
DIP-8 MILLIMETERS MIN. MAX. 5.33 0.38 2.92 0.36 1.14 0.20 9.01 0.13 7.62 6.10 2.54 BSC 7.62 BSC 10.92 2.92 3.81 8.26 7.11 4.95 0.56 1.78 0.35 10.16
E1
A A1 A2 b
0.38
eA eB A2 A
b2 c D D1 E
WITH PLATING
E1 e
A1
L
A
A
BASE METAL SECTION A-A
eA eB L
D1 b2 e
Note: 1.Refer to JEDEC MS-001BA. 2.Dimension D, D1 and E1 do not include mold flash or protrusions. Mold flash or protrusion shall not exceed 10 mil. 3.Controlling dimension is millimeter, converted inch dimensions are not necessarily exact.
10/23/2007 Rev.1.00
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SS6526
MSOP-8
D
S Y M B O L
MSOP-8 MILLIMETERS MIN. MAX. 1.10 0.05 0.75 0.25 0.13 2.90 4.90 BSC 2.90 0.65 BSC 0.40 0 0.70 6 3.10 0.15 0.95 0.40 0.23 3.10
A
E1
E
A1 A2 b c D
AA
A2
e
SEE VIEW B
E E1 e
A
L
A1
b
WITH PLATING
0.25
BASE METAL SECTION A-A
L
VIEW B
Note: 1. Refer to JEDEC MO-187AA. 2. Dimension "D" does not include mold flash, protrusions or gate burrs. Mold flash, protrusion or gate burrs shall not exceed 6 mil per side. 3. Dimension "E" does not include inter-lead flash or protrusions. Inter-lead flash and protrusions shall not exceed 10 mil per side. 4. Controlling dimension is millimeter, converted inch dimensions are not necessarily exact.
Information furnished by Silicon Standard Corporation is believed to be accurate and reliable. However, Silicon Standard Corporation makes no guarantee or warranty, expressed or implied, as to the reliability, accuracy, timeliness or completeness of such information and assumes no responsibility for its use, or for infringement of any patent or other intellectual property rights of third parties that may result from its use. Silicon Standard reserves the right to make changes as it deems necessary to any products described herein for any reason, including without limitation enhancement in reliability, functionality or design. No license is granted, whether expressly or by implication, in relation to the use of any products described herein or to the use of any information provided herein, under any patent or other intellectual property rights of Silicon Standard Corporation or any third parties.
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